Advanced Packaging

Vacuum Deposition Equipment for Wafer or Panel-Level Substrates

With advanced packaging, the boundaries of the semiconductor backend processes of packaging and PCB manufacturing are merging.

Increasingly complex electrical systems are being manufactured in three-dimensional structures. The requirements for the conductive and insulating layers are becoming higher and the manufacturing sizes of the panels larger in order to be able to produce cost-effectively.

To manufacture these systems, specially adapted coating equipment is required. And this is exactly what we can offer you.