Lift-off Processes

Vakuum­beschichtungs­anlagen für Metallisierung

Every electrical system needs electrical connections. In back-end applications, they are created by combining a two-dimensional thin-film process with prior photolithographic masking.

The masked areas are removed after coating, lifted off, so to speak. This makes it possible to create small structures very effectively. The prerequisite for this is appropriate layer properties and good coverage of relevant areas and no damage to the photoresist.

For these processes, we offer you  vacuum coating systems for metallization. They are suitable for deposition solutions of different metals for different applications with and without adhesion promoter, and with temperature treatment.