In-house Development
Simulation‑driven system design
Gas flow dynamics, electric and magnetic fields (E, B), ion extraction, as well as plasma and cathode erosion behavior
Dedicated test bench infrastructure for validation and optimization
Extensive intellectual property portfolio
- DE 10 2012 210 003 B4 (compartment)
- DE 10 2014 106 942 B4 (anode)
- DE 10 2016 105 462 B4 (anode)
- DE 10 2016 109 124 B4 (body)
- DE 10 2016 114 480 B4 (anode)
- DE 10 2020 114 162 B3 (process)
In-house Sampling
In-house sampling capabilities on multiple inline coating platforms
Evaluation of dynamic etching rates, system lifetime, contamination behavior, and process integration
Flexible hardware configurations
Power supply units (PSU), cathode and anode materials, extraction slit geometry, and compartment design
Advanced software functionalities
Ramping profiles, gas purging sequences, and precise PID-based power control
Large-Area Glass Pretreatment
Tool integration
Lid-mounted single or dual configuration
Upgradeable design
From single to dual
Adjustable ion beam incidence angle
Onboard PLC
Seamless integration with coater PLC and HMI
Fully equipped system
TMP, gas supply, MFCs, pressure gauge
Fast cathode exchange
Without opening vacuum or water seals
Process compartment optimization
Adaptation of rollers, shields
Technological integration
High‑voltage, high‑power design
Water‑cooled anode and body,
up to 5 kV / 5 kW/m DC
High dynamic etch rate design
der > 15 nm*m/min (float glass)
Stable and reproducible
Integrated ion beam neutralizer
Magnetron-compatible operation
Pressure range 0.5–10 × 10⁻³ mbar
(0.4 mTorr to 7 mTorr)
Uniformity tuning by gas flow adjustment
Non-uniformity (der) < ±15% to ±5%




